Silicon wafer dicing
Silicon wafer dicing is one of those niche services that you may not even know exists or that you need until you do. So if you are in the market for a good service provider for wafer dicing, how can you make a smart and informed decision? Although there are numerous factors to consider, here are some of the most important points to keep in mind.
Some of the better wafer dicing companies have been at this work for decades. Obviously, a company with that much experience is preferable to one that has only recently entered the market. Such a company will have much more experience to draw upon, thus providing you with a high level of precision.
Just as there are many types of companies, so there are many methods for dicing silicon wafers. If you select a company that offers a number of different methods, you can rest assured that the company does not take a one-size-fits-all approach to your job. Rather, the best companies will employ techniques such as ultrasonic cutting, diamond technology, and laser cutting. In this way, you get the highest possible quality in cuts for your particular needs.
In addition to having technical expertise and versatility, the right company should be able to provide you with good customer service. This goes beyond merely being polite and helpful, although that is important. It is crucial that the company you choose be able to deliver its work in a timely manner. After all, time is money. Some of the better wafer dicing companies out there offer a turnaround time of a single day for most jobs. This means less time spent waiting and more time spent doing what you do best.
If you take your time and select the right company for your wafer dicing needs, you will be sure to see impressive results.